Behind the Build: The Engineers Powering the Hyperion
When you think of our cutting-edge oceanographic sensors, you might picture our sleek silver instruments. But behind every high-performance sensor is a team of engineers solving complex problems, pushing boundaries, and turning ideas into reality. The Hyperion project is a perfect example.
At the heart of the project was a diverse and highly skilled engineering :
- Jay Nicholson, Head of R&D
- Surya Dinesh, Project Lead
- James Morris, Optics Engineer
- Zacc Cutting and Robert Card, Electronics Engineers
- Richard Thurley, Firmware Engineer
- Neil Hughes, Mechanical Engineer
Engineering for the Extreme
This wasn’t your average water quality sensor. The goal was a sensor that could operate at 6000 meters below sea level – ten times deeper than most competitors. That meant designing for crushing pressures and corrosive conditions. The solution: a 3D-printed titanium housing and sapphire windows, chosen for their strength and scratch resistance.
Space was also a premium. The sensor had to fit into a 24mm diameter to integrate with existing Valeport systems. That required ultra-compact PCB design and the use of tiny, high-performance components – a true feat of engineering.
To streamline production and reduce costs, the team designed a single drive PCB that works across all sensor variants. They also implemented a pre-assembly calibration process, allowing production to stock calibrated sensors and reduce the lead time for customer orders.
Design, Test, Repeat
The path to perfection wasn’t linear. The team went through multiple rounds of prototyping and testing, refining the design with each iteration. Regular project meetings kept everyone aligned, and feedback loops especially around power consumption led to smarter, more efficient designs. For example, by maximizing light throughput, they were able to reduce LED power and overall energy use – crucial for remote deployments like buoys and unmanned vehicles. Eco-conscious choices were also part of the process. The team reduced the number of encapsulation materials and curing stages, cutting down on waste and assembly time.
What We Learned
This project sparked fresh ideas in PCB design and integration. It challenged the team to think creatively, collaborate closely, and innovate under pressure. And while the work was demanding, it was also deeply rewarding.
What’s Next?
We have a new parameter launching in the next few weeks, and future developments are in the pipeline for new parameters coming soon.